Laser cutting of materials

Laser cutting is performed by moving a focused laser beam along a workpiece. The heat affected material is often removed with the help of an ejection gas blown out in the kerf through a nozzle centered with the laser beam. For thin materials like fabric or plastic films, there is no need for an ejection gas to remove the ablated material. The choice of the laser cutting technology will be made based on the application requirements. The different choices available concern the type of laser source (CO2 or fiber laser) and the beam displacement system technology (XY table or galvo scan head). Galvo scan heads are use for very thin materials and small areas. XY tables are used for thicker materials and when a large area needs to be covered. The material thickness and the cutting speed requirements are the main parameters that set the power level requirements for the laser cutting machine.