Laser for Semiconductor Manufacturing

Laser Marking for Wafer Traceability

Wafer laser marking produces permanent identification directly on silicon wafers for complete traceability throughout semiconductor fabrication.

Using highly controlled laser energy, manufacturers can create readable marks such as lot numbers, serial numbers, or Data Matrix codes with exceptional precision and minimal surface impact. Advanced debris-free “soft marking” techniques can even create ultra-shallow micro-dimples without material removal, helping prevent contamination in cleanroom environments. 

Laser wafer marking is ideal for automated semiconductor manufacturing because it combines high repeatability, micron-level accuracy, and compatibility with downstream processes such as coating, deposition, and lithography. 
 

Laser Micro-Texturing for Wafer Surface Engineering

Wafer micro-texturing creates precise surface features on semiconductor wafers to enhance performance, improve process control, and support advanced device manufacturing.

Using ultrafast laser pulses, manufacturers can generate highly uniform microstructures with micron-level accuracy while minimizing thermal effects on the surrounding material. These engineered textures can optimize surface properties such as adhesion, wettability, light absorption, or bonding performance, depending on the application requirements.
 

Laser Scribing for Wafer Dicing Preparation

Laser wafer scribing creates precise, controlled fracture lines on silicon and compound semiconductor wafers, preparing them for clean, high-yield die separation.

This process can scribe narrow, shallow grooves along the wafer's crystal planes with micron-level accuracy and minimal mechanical stress. This non-contact process reduces microcracking and edge damage compared to traditional saw dicing, helping preserve die strength while supporting narrower street widths and higher material yield.

Laser wafer scribing is ideal for wafers as thinness and tight die spacing make conventional mechanical dicing impractical.

Laser Cleaning for Wafer Surface Preparation and Reclamation

Laser cleaning removes organics, oxides, residues, and other contaminants from wafer surfaces without damaging the underlying substrate.

This process can ablate unwanted surface layers with micron-level selectivity, leaving the wafer material intact. This dry, non-contact process eliminates the need for chemical baths or abrasive treatments, reducing the risk of substrate damage while supporting cleaner, more consistent surface conditions ahead of subsequent processing steps.

Laser cleaning is well-suited for surface preparation and wafer reclamation, where restoring a contaminant-free, defect-free surface is essential for reuse or continued fabrication.

Laser Cleaning for Selective Layer Patterning

Laser cleaning removes organics, oxides, residues, and other contaminants from wafer surfaces without damaging the underlying substrate.

This process can ablate unwanted surface layers with micron-level selectivity, leaving the wafer material intact. This dry, non-contact process eliminates the need for chemical baths or abrasive treatments, reducing the risk of substrate damage while supporting cleaner, more consistent surface conditions ahead of subsequent processing steps.

Laser cleaning is well-suited for surface preparation and wafer reclamation, where restoring a contaminant-free, defect-free surface is essential for reuse or continued fabrication.

Laser Depaneling of Semiconductor PCBs

UV lasers enable high-precision PCB depaneling by separating individual boards from a panel without mechanical contact.

Their short wavelength and low thermal impact help minimize the heat-affected zone while avoiding the mechanical stress associated with traditional depaneling methods. This makes UV lasers particularly well-suited for thin, densely populated, rigid-flex, and other sensitive PCB assemblies. As a result, manufacturers can achieve clean-cut edges, protect nearby components and circuits, improve yields, and support increasingly compact PCB designs.