Laser Marking for Semiconductor Manufacturing

Wafer Laser Marking

Wafer laser marking produces permanent identification directly on silicon wafers for complete traceability throughout semiconductor fabrication.

Using highly controlled laser energy, manufacturers can create readable marks such as lot numbers, serial numbers, or Data Matrix codes with exceptional precision and minimal surface impact. Advanced debris-free “soft marking” techniques can even create ultra-shallow micro-dimples without material removal, helping prevent contamination in cleanroom environments. 

Laser wafer marking is ideal for automated semiconductor manufacturing because it combines high repeatability, micron-level accuracy, and compatibility with downstream processes such as coating, deposition, and lithography. 
 

Laser Marking and Engraving of Semiconductor Packages

Laser marking and engraving systems create permanent identification marks on semiconductor packages, ICs, electronic components, and molded substrates.

Manufacturers use laser processing to apply logos, serial numbers, part numbers, QR codes, and regulatory markings with high contrast and excellent readability.

Because the process is non-contact and highly precise, laser marking preserves component integrity while ensuring marks remain durable through soldering, cleaning, and long-term operation.

Laser Etching for Semiconductor Traceability

Laser etching can support end-to-end semiconductor traceability by permanently marking wafers, dies, and packaged components with unique identifiers. These marks allow manufacturers to track products throughout fabrication, assembly, testing, and distribution while improving quality control and defect analysis.

Laser etching provides reliable readability on a wide range of semiconductor materials and supports automated inspection systems used in modern factories and production lines.

Subsurface Laser Marking for Semiconductor Components

Subsurface laser marking creates permanent identifiers beneath the surface of transparent or sensitive semiconductor materials without damaging the exterior layer.

This technique protects markings from abrasion, chemicals, and environmental exposure while maintaining the component surface’s appearance and functionality. 

Subsurface marking is particularly valuable for applications requiring tamper-resistant identification, long-term durability, or contamination-free processing in semiconductor manufacturing environments.