The Linear UV Laser System offers high precision and speed for coding/marking, micro-machining, texturing and drilling applications. Its versatility and marking-on-the-fly capability enable high-volume, permanent markings on plastics, glass, metals, ceramics, PCBs, making it perfect for traceability and identification on sensitive materials.
Our UV laser system delivers industry-leading speed and precision for high-performance manufacturing in demanding industries. Its high repetition rate and short pulse duration allow high-contrast and delicate marking with minimal heat input, making it ideal for high-throughput operations.
Our easy-to-use marking software combined with a high-speed galvo scanner enables consistent marking on moving parts. For MOTF serialization, it can communicate with other production devices and be integrated into automated production lines.
Thanks to its flexible process parameters, our UV laser system can perform non-thermal marking, texturing and micro-machining through 4 output orientations (top, bottom, left or right). This versatility makes it ideal for a wide range of components in the medical, aerospace and electronics industries.
The system's wide field of view and advanced lensing adapt to demanding spot size and work area needs, from fine features to large-scale processing (up to 1.05m x 1.05m). This flexibility accelerates deployment, minimizes changeovers, and future-proofs the cell as requirements evolve.
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Our UV laser markers range from 1W to 55W. Power options currently available are: 1W, 2W, 3W, 5W, 10W, 15W, 20W, 40W and 55W.
Our UV laser markers are available in nanosecond (ns), picosecond (ps), and femtosecond (fs) pulse durations to match the laser process to the material's absorption characteristics and application requirements.
Picosecond and femtosecond UV configurations are offered in specialized setups, as they require a format different from the standard-size Linear Head.
Our wide spot size range (7-100um) makes it easy to tailor the laser solution to your specific applications, materials and power/speed requirements.
If the spot and field sizes are compatible, an f-Theta lens can keep the laser beam in sharp focus. It also ensures consistent 2D marking on flat surfaces.
Marking-on-the-fly (MOTF) capability enables high-speed marking on moving parts, using real-time encoder feedback to dynamically adjust laser firing timing.
This is critical for inline production lines where stopping parts is not feasible. The system compensates for linear speed variations, ensuring precise and distortion-free marks.
Quadrature encoder input (A/B channels with optional Z-reference) enables high-resolution positional feedback for synchronized laser marking.
This signal allows the laser controller to accurately calculate velocity and displacement in real time, ensuring precise trigger points and consistent mark positioning—especially important in rotary or conveyor-based systems.
The UV laser system supports industrial-grade communication protocols such as EtherNet/IP, PROFINET, Modbus TCP, and RS-232/485.
This flexibility enables direct integration with PLCs, HMIs, and SCADA systems for real-time control, diagnostics, and traceability.
It simplifies system architecture and enhances interoperability in Industry 4.0-ready environments.
Laser marking of plastics and other materials can generate hazardous fumes and fine particulate matter. Our fume extraction units integrate HEPA and activated carbon filtration, removing harmful emissions and protecting both optical components and personnel.
An external power meter module enables real-time monitoring of UV laser output at the work surface, measuring actual delivered energy to ensure process stability.
It helps calibrate marking parameters and detect power drift in precision-critical environments. This is especially valuable in production settings requiring consistent laser fluence across batches.
The Linear UV offers a wide range of configurations to meet all types of marking demands.
UV ns | UV ps | UV fs | IR fs | |
|---|---|---|---|---|
| Nominal Laser Output Power (Watts) | 1, 2, 3, 5, 10, 20, 40, 55 | 3, 10, 20, 50 | 5, 10 | 10, 20, 30, 40, 50, 60, 70, 80 |
| Power Consumption | 900 W - 2000 W | |||
| Laser Type (Diod Pump Solid State ) | UV | IR | ||
| Supply Voltage | 90 - 240 VAC | |||
| Pulse Energy | 300 uJ - 500 uJ | 50 - 200 uJ | 20 - 200 uJ | 50 - 200 uJ |
| Pulse Width | 7 - 50 ns | 2 - 10 ps | 270 - 400 fs | |
| Wavelength | 355 nm | 343 nm | 1030 nm | |
| Beam Quality | TEM 00 < 1.3 | |||
| Laser Safety Class | Class 4 laser product: CSA-E60825-1:15, 21 CFR 1040.10, IEC 60825-1 | |||
| Cooling | Water (Air Cool Optional < 10 W) | |||
| Laser Source MTBF | 10 000 - 15 000 Hours | |||
| Barcode Validation (Optional) | External | |||
| I/O | Hardware IOs (DB37) | |||
| Communications | TCP/IP or RS232 | |||
| Dimensions (L x W x H) | 914 x 269 x 210 mm | 1000 x 305 x 203 mm | 1000 x 305 x 254 mm | |
| Weight | 20 kg - 40 kg | 30 - 50 kg | 50 - 90 kg | |
| Environmental Conditions | 10 °C to 35 °C | |||
| Approvals | CE | |||
| Cooling System Dim. (L x W x H) | 287 x 224 x 389 mm | 287 x 224 x 389 mm | 592 x 377 x 650 mm | |
| Cooling System Weight | 9 kg | 40 kg | ||
| Nominal Spot Size | 10 - 100 µm | 20 - 120 µm | 30-150 µm | |
UV ns | UV ps | UV fs | IR fs | |
|---|---|---|---|---|
| Effective Z-Focusing Range (3D heads) | Typical +/- 15mm | |||
F-Theta (Flat Field Lens) | Non Flat | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Focal Length (mm) | F-56 | F-103 | F-250 | F-330 | F-511 | F-810 | 150 | 200 | 250 | 300 | 400 | 500 | 1000 |
Max Scanning Speed | Up to 16 m/sec | ||||||||||||
Nominal Spot Size (µm) | 7 | 12 | 25 | 30 | 50 | 60 | 16 | 20 | 25 | 30 | 40 | 50 | 100 |
Nominal Marking Distance (mm) | 122 | 220 | 388 | 399 | 674 | 1063 | 150 | 200 | 250 | 300 | 400 | 500 | 1000 |
Effective Z-Focusing Range (3D heads) | +/- 15 mm | ||||||||||||
Nominal Marking Field Size (mm) | 16 x 16 | 50 x 50 | 160 x 160 | 205 x 205 | 305 x 305 | 445 x 445 | 29 x 29 | 42 x 42 | 61 x 61 | 80 x 80 | 125 x 125 | 170 x 170 | 350 x 350 |
| Depth of Focus | 25 µm | 66 µm | 185 µm | 400 µm | 1.15 mm | 1.66 mm | 460 µm | 738 µm | 738 µm | 1.66 mm | 3.20 mm | 4.61 mm | 18.46 mm |
Open-air enclosures are Class-1 certified products that can be integrated to your laser machine designs.
The high-power series can meet shorter cycle times with up to 500 watts of laser power. They are commonly used for laser cleaning, texturing, and hardening.
CO2 lasers are used to mark organic materials like plastic, polymer, rubber and cardboard.