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WAFER LASER MACHINE
Wafer Marking

Wafer Laser Marking Machine

The Wafer Laser Machine is a production-ready laser machine engineered for high-accuracy wafer processing, from fast, precise marking to surface preparation and dicing. It pairs a precision laser source with high-resolution scanning optics and automated wafer handling in a standard configuration built for consistent, repeatable results. A range of laser types and optical setups are available, allowing the system to be tailored for optimal performance across different material types.

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Benefits of the WAFER LASER marking MACHINE

High Precision With No Mechanical Stress

Our UV laser delivers cold marking technology that eliminates mechanical stress on delicate wafer surfaces. By minimizing the heat-affected zone (HAZ), we protect wafer integrity while achieving unmatched marking clarity. The result: cleaner marks, stronger wafers, higher yields.

Automated Handling and Alignment 

Two front-opening load ports feed a pre-aligner and handling robot, so production runs cassette to cassette without an operator. Before the laser fires, vision locates the notch and wafer edge, or the die grid and its alignment marks, and solves translation, rotation and scale. Every mark is placed against the wafer itself, not assumed coordinates: one ID per wafer, or one per die.

High Materials and Process Versatiliy

Built for versatility, the Wafer Laser Machine adapts to a wide range of applications and materials, no matter your wafer type or process requirements. From precision marking to surface preparation and scribing, a single platform handles it all. Flexibility engineered in, so your production never has to compromise.

Higher Yield for Your Production

The Wafer Laser Machine is engineered for efficient, high-throughput processing without compromising quality or compliance. Streamlined automation and rapid, precise laser processing minimize cycle times and eliminate bottlenecks, while consistent accuracy across every wafer protects yield. The result is high-volume production that delivers both speed and quality.

Single-Source Responsibility

The Wafer Laser Machine is delivered as a fully integrated solution from a single supplier, covering the laser source, workstation, automation, and controls. This ensures system-level compatibility, consistent performance, and simplified support throughout the machine lifecycle. 

Scalable from Manual to Automated Production

The Wafer Laser Machine supports both manual and automated operation, allowing manufacturers to start with assisted processes and scale toward higher levels of automation as production volumes and requirements evolve.

Engineered for Your Production Environment

Beyond standard configurations, the Wafer Laser Machine can be adapted with vision systems, industrial communication protocols, and custom equipment to meet specific quality, traceability, and factory integration needs. 

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